Headquartered in Israel, present in North America, Europe, and Asia, SELA's standing in its market place is undeniable.
By strategically placing offices and distributors around the world, SELA has the ability to be in constant contact with its clients. This also enables the company to work closely with major semiconductor companies to continually improve our products and be able to keep up with the ever changing industry.
Here is what our customers have to say about SELA and its microcleaving tools:
CEA-LETI , France
"I am very glad to say you that our TEMpro system gives us full satisfaction. We obtain samples with a very good accuracy even for small pattern details, correctly positioned on support, with vertical and straight walls. The yield is better than 95% and the system is easy to be used by non-specialist workers." - Dr. Robert Truche, Lab Manager
SMIC (Semiconductor Manufacturing International Corporation), Shanghai , China
"I recommend the MC600 to my colleagues that are interested in high quality, accurate and fast preparation of SEM samples. Our lab supports process development, manufacturing process control and failure analysis. The SELA MC600 system gives us quick and accurate cross-sections of structures, often with accuracy better than 0.2 micron. The 9-minute full process is used most, but the 3-minute quick cleave' option is used to save time when there is less emphasis on the accuracy and more on viewing the process layers. We have eight users in the FA lab operating the system every day. Sample turn-around time and efficiency in the lab have improved greatly." - Lisa Tsou, Principal Engineer in the Reliability Engineering Analysis Laboratory
Siltera
Tagline: MC500 at Siltera out-performing conventional SEM sample preparation.
"SELA's MC500 is working very well for us. Since we received the system in June of 2000, the MC500 has proven itself to prepare SEM samples with great accuracy and minimal artifacts. Compared to manual cleaving and polishing techniques, the MC500 is much faster. We regularly make cross sections of target features <1um in size with resists on, which cannot be done with manual techniques. I'm impressed with the tool's uptime, which is greater than 90%. I certainly recommend the MC500 to my colleagues that are interested in producing high quality, accurate and fast preparation of SEM samples." - Senior FA engineer
Lam Research
"The ability to cleave wafers for clean cross-section SEMs of very small features has become an integral part of equipment demonstration work. Our customers ask us to look at many different small features during demonstration and development work. The SELA system gives us quick and accurate sections of structures that in the past were impossible to see. For example, a recent demo required cleaving through a 10um portion of a CD SEM bar. I used the single scribe and cleave process on the MC200 to cleave through it in just a few minutes. Our ability to provide timely and accurate process optimization for our customers is greatly enhanced with the SELA system. The liquid N2 feature allows us to look at metal features without stretching or smearing. We found the system easy to learn and use." - Rich Meinecke, Staff Process Engineer
Motorola MOS6
"The Microcleaving system empowers the technicians, enabling less senior personnel to perform at the same high levels as more experienced staff. Our results have a wider impact, such as a reductions in SEM lab cycle-time which can improves productivity, boost competitiveness and cuts overall costs." - Vicky Allison, SEM Lab Group Leader
CNET
"It is so difficult to distinguish between an image distortion and a true feature - introducing an artifact can change the entire picture. Smaller features frequently demand resolutions of 200,000x to 500,000x magnitude. We rely on the microcleaving system to achieve an accurate cleave without producing any artifacts. The resulting cross-section allows full utilization of the SEM's capabilities, and most importantly, yields a correct analysis." - Daniel Jourdain, Analytical Lab Manager
IDT
"The SELA MC200 has enable us to monitor process control parameters that were previously unavailable to us. The ability to efficiently obtain clean cross-sections on very small feature sizes in under 10 minutes is an invaluable tool, especially when our wafer fab is producing deep sub micron technology. The MC200 is not a luxury, it is a necessity in our lab." - Gary Schulz, Analytical Lab Supervisor
Hewlett-Packard
"HP is a forward-looking company that is very quality conscious. Our lab supports the development and front-end manufacturing of HP's innovative ASICs. Having worked successfully with the SELA MC100, I felt great confidence in upgrading to the SELA MC200. And the MC200 is even better than I anticipated." - Doug Edwards, Failure Analysis Lab Maintenance Technician
Motorola APRDL
"Many more samples have to be examined to support both our embedded systems solutions development and manufacturing activities, and our high throughput and ease-of-operation experiences with the MC200 and MC500 systems led us to order the third system immediately after becoming responsible for manufacturing support. We currently prepare several thousands of samples per month and can now train our SEM technicians much more quickly than with the old methods. The microcleaving technique takes the guesswork out of SEM sample preparation, making our operation both more efficient and more responsive." - David Sieloff, FA Physical Analysis Lab Manager |
